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MT Surface Mount Technology Analysis – Content Introduction
Addtime:2013/5/17 18:19:53 Clidk:8848

SMT Surface Mount Technology Analysis – Table of Contents:

I. Introduction to Surface Mount Technology
II. Surface Mount Components and Component Packaging
III. Surface Mount Printed Circuit Boards
IV. Designing for Assembly (DFA)
V. Soldering Materials and Related Issues
VI. Application Methods of Adhesives and Solder Paste
VII. Component Placement

SMT Surface Mount Technology Analysis – Content Summary:

Matrix Trays

Matrix tray packaging was developed to accommodate the picking and placing of flat-packaged components, ensuring that the fragile leads of such components are not damaged during the pick-and-place process. These trays are generally made from two types of plastic: one type can withstand the baking process during component drying (refer to IPC-SM-786, Testing and Handling of Surface Mount Plastic Packages Susceptible to Moisture-Induced Cracking), which is made from high-temperature plastic; the other type, made from low-temperature plastic, cannot be used in the baking process. Standards for matrix trays are specified in the JEDEC publication issued in 1995.

Advantages:
In the United States, most suppliers use matrix trays to package BQFP components. Supporting the component by its body is generally preferred over supporting it by its leads, as flat-pack components can be easily stored, transported, and used in matrix trays. Although matrix trays can be relatively expensive, consideration should be given to establishing processes that take advantage of their reusability. Currently, QFP components in Japan have already transitioned to tape-and-reel packaging.

Concerns:
Cost is a primary consideration when using matrix tray packaging, as this packaging method is more expensive than tape-and-reel packaging. As a result, many U.S. manufacturers are now following the example of Japan and transitioning toward tape-and-reel packaging to reduce costs.
 
 

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